Proprietary systems have traditionally dominated the control of three and four-axis wafer handling robots for in-vacuum and in-air wafer applications. As a result, these systems can be limited in ...

German automation specialist Acp systems developed an advanced robotics solution integrating image processing to handle a range of wafer sizes and tolerances within a vapor deposition process for a ...

ERS's new Luminex machines offer a unique solution for stress-free debonding, saving more than 30% in operation costs compared to traditional laser debonding. They are engineered with robust wafer ...